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Wireless Docking Station Uses WiQuest RF Solution
Kensington has selected WiQuest Communications Inc. as the sole wireless USB solution provider for the new Wireless USB Docking Station—the first wireless USB docking station certified by the USB-IF. The system uses WiQuest’s Wireless USB Device Mini Card reference design.
Report Cites Chip Programming For iPhone 3G Problems
Problems involving dropped calls and the inability to receive faster 3G service on Apple’s new iPhone 3G may be related to a communications chip made by Infineon Technologies. Sources quoted by BusinessWeek said that faulty software on the chip causes problems when the iPhone needs to switch from wireless networks that allow faster downloads to slower ones.
A Summary Of The DDR Memory Controller Standard—Wait, There Isn’t One!
The number of SoCs that require an interface to off-chip memory is increasing. As a result, more and more designers are turning to DDR SDRAM interfaces such as DDR, DDR2, and DDR3 to address their low-cost, security of supply, storage capacity, and performance requirements. Fortunately for those designers, DRAMs have been standardized since the 1970s. But this still leaves a challenge that most SoC engineers don’t recognize until things start to go wrong.
DC-DC Converter Uses Microchip Op Amp, MCU
Citing the breadth of Microchip Technology Inc.’s analog and digital products, Bel Power Inc. has selected two Microchip devices for use in a next-generation Power over Ethernet (PoE) half-brick dc-dc converter.
STMicroelectronics, STATS ChipPAC, And Infineon Join Forces On Wafer-Level-Packaging
Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) technology. The technology will be based on Infineon’s existing eWLB packaging, which has been licensed to both STMicroelectronics and STATS ChipPAC.
Visual Embedded Design Tools + ANSI C = New Challenges
Recently, I encountered a real gotcha while updating a visual design tool. The update included support for a new compiler vendor who was, in fact, becoming the new default compiler. So I updated the tool, loaded a project that worked five minutes earlier, rebuilt the project with no errors and no warnings, and then programmed the part. I applied power, and nothing happened! Not one line of code had changed, and no errors or warnings were generated. What was the problem?
Panasonic Picks Altera FPGAs For HD Camcorders
Panasonic has incorporated Altera Corp.’s Cyclone III FPGAs into its P2 professional-grade HD camcorders. The FPGAs provide HD video processing, an interface to P2 memory cards, and LCD display control. The devices deliver the highest ratios of memory-to-logic and DSP-to-logic of any low-cost FPGA family, according to Altera.
LabVIEW-Based Systems Monitor Health Of Chinese Megastructures
The China Earthquake Administration has selected a structural health monitoring (SHM) system from CGM Engineering Inc. to help engineers conduct research on seven recently constructed megastructures. CGM, a National Instruments Alliance Partner, based the system on the NI LabVIEW graphical system design platform and NI CompactRIO programmable automation controllers.
WiMAX MIMO Device Uses SkyCross Antenna Technology
The first USB device certified by the WiMAX Forum, the MiMAX Q-Series USB dongle from Airspan Networks Inc., incorporates the SkyCross Isolated Mode Antenna Technology (iMAT). Introduced by SkyCross in late January, iMAT allowed the MiMAX to be certified for the 2.5-GHz band, operating at nearly every applicable WiMAX and Wi-Fi frequency from 2 GHz to 5 GHz.
Mitel Picks Octasic For Echo Cancellation
Mitel has chosen Octasic Inc.’s media processing technology to provide echo cancellation for the Mitel 5000 Network Communications Solution and the Axxess Converged Communication System. The Axxess product line uses open architecture interfaces and standard protocols to transparently combine IP, wireless, digital, and analog into a single platform to unify communications into one interoperable enterprise.
TI Announces 2009 Roadmap For Low-Power Processors
Texas Instruments has revealed a low-power processor roadmap for 2009 that includes more than 15 new multi-architecture devices across four product lines. A breakthrough, the company says, will be the industry’s lowest power floating-point DSPs, the TMS320C674x family. For the first time, designers will be able to bring portability to applications requiring the high-precision and fast time-to-market provided by floating-point processors.
The Power Of The Portfolio Can Maximize Software Development
Today, most companies target the needs of their prospective customers by creating a product line rather than a single product. Yet due to multiple intertwined products with different features and production deadlines, developing software for a product line is extremely complex. These challenges can hinder your company’s ability to capture the window of opportunity, maximize quality, and expand the scope of your product-line portfolio, making it difficult to obtain a competitive edge.
iPhone Adds 3G Functionality, Drops Cost
iSuppli – After a teardown of the iPhone 3G, iSuppli Corp. confirmed a significant drop in bill of material (BOM) costs, indicating a cheaper end product than last year’s 2G iPhone. At $174.33, the BOM and manufacturing cost of the new iPhone is markedly less than the $227 that iSuppli estimated for the first-generation, 8 Gbyte 2G version in June 2007. This strip down results in about $100 less for consumers, totaling $499 for the iPhone 3G, whereas last year’s model called for $599.
MontaVista µSELinux
Technology Editor Bill Wong talks with MontaVista about Mobilinux 5.0, which includes support for SELinux security features.
iPhone Drops The BOM
How does Apple improve on cutting-edge technology? Check out the 3G iPhone's bill of materials (BOM), released by iSuppli.
“Pocket” Printer Integrates Bluetooth Stack, IC
The BlueStack and Interface Express software packages from Cambridge Consultants have enabled PlanOn Systems Solutions Inc. to design a “pocket-size” printer with Bluetooth connectivity. The Printstik, which measures just 48 by 25 by 280 mm (1.89 by 0.9 by 11.02 in.), incorporates the BlueStack software on a single BlueCore chip from Cambridge Silicon Radio. The ruggedized printer weighs 680 g (1.5 lb.).
PCI Express TV Tuner Powered By NXP Semi ICs
Hauppauge Computer Works’ PCI Express TV tuner will employ three ICs from NXP Semiconductors. The WinTV-HVR-2250 will incorporate the NXP SAA7164E PC TV system-on-a-chip (SoC) as well as two TDA18271HD silicon tuners.
Apex Digital Converter Box Uses Zoran Processor
The National Telecommunications and Information Administration (NTIA) has certified Apex Digital Inc.’s DT250 ATSC analog pass-through converter box to participate in the government’s coupon program. The box incorporates the SupraHD 741 processor design from Zoran Corp. The Coupon-Eligible Converter Box program supports the conversion of U.S. television broadcasts from analog to digital technology.
Waterproof Cells Phones Add Fingerprint Sensor
A new waterproof cell phone scheduled for high-volume production in the fourth quarter of 2008 will employ AuthenTec’s TouchStone fingerprint sensor packaging technology, according to Authentec. The TouchStone package allows easy integration into various waterproof industrial design configurations. It offers the durability and water resistance required for this new class of handsets while adding Power of Touch features, including security, convenience, personalization, and navigation.
Horizon And Scorpus Collaborate On Digital-Video Decoder/Processor
Scopus Video Networks will use Horizon Semiconductor's high definition decoding technology in its receiver processor for multi-channel ATSC decoding/down conversion. Horizon designs semiconductor devices used for secure video/audio compression and transmission in the consumer electronics and broadcast markets.
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